We are thrilled to announce that Convida’s engineers will actively participate in several significant 3GPP meetings throughout 2024, contributing to the development and standardization of cutting-edge technologies. These engagements reflect Convida’s commitment to driving innovation and leadership in the telecommunications and IoT sectors. The upcoming 3GPP meetings include:
3GPP SA6 Meetings:
3GPP SA1 Meetings:
Convida’s participation in these meetings underscores our dedication to influencing the future of telecommunications and IoT technologies. By actively engaging in these critical discussions and decision-making processes, our engineers continue to drive forward the advancements that shape the industry.
About Convida:
Convida is a pioneering technology company specializing in the development and licensing of innovative solutions for the Internet of Things (IoT) sector. As a joint venture between InterDigital Inc. and Sony Corp of America, Convida leverages cutting-edge technology to enable advanced service layer network functionalities, facilitating seamless connectivity and efficient data management across devices. Our mission is to empower application developers, cloud and edge service platforms, and telecommunications providers with robust tools to enhance device interoperability and optimize user experiences in the rapidly evolving IoT landscape. Convida is committed to driving innovation and delivering value through strategic intellectual property management and collaborative industry partnerships.
We look forward to sharing more updates from these meetings and highlighting our contributions to the global telecommunications and IoT landscape.
For more information, please visit our website or contact our press office.